1 |
Layer |
1-6 layer |
1-6 layer PCB prototypes |
2 |
Ink |
TAIYO |
White: TAIYO 2000 series Green: TAIYO 07 series |
3 |
Material |
FR-4 |
FR-4 material only (KB6160A TG130) |
4 |
Max. Dimension |
550x650mm |
Standard dimension is 550*650mm |
5 |
Dimension Tolerance(Outline) |
±0.15mm |
±0.15mm for CNC routing, and ±0.5mm for V-scoring |
6 |
Thickness |
0.8--2.4mm |
0.8/1.0/1.2/1.6/2.0/2.4mm |
7 |
Thickness Tolerance( t≥1.0mm) |
± 10% |
+10% will occur for the technologies like electroless copper, solder mask and pad plating. |
8 |
Thickness Tolerance( t<1.0mm) |
±0.1mm |
+0.1mm will occur for the technologies like electroless copper, solder mask and pad plating. |
9 |
Min. Trace |
5mil(0.125mm) |
Min. trace is 5 mil. More than 6 mil is recommended to save cost. |
10 |
Min. Spacing |
5mil(0.125mm) |
Min. spacing is 5 mil. More than 6 mil is recommended to save cost. |
11 |
Finished Outlayer Copper |
35um/75um(1 OZ/2 OZ) |
Also known as copper weight. 35μm=1oz, 70μm=2oz |
12 |
Finished Inerlayer Copper |
35um |
35μm=1oz |
13 |
Drill Size |
0.3--6.3mm |
Min. drill size is 0.3mm, Max. drill size is 6.3mm. Any holes greater than 6.3mm will charge extra fee. |
14 |
Annular Ring |
≥0.153mm(6mil) |
Annular ring surrounded by traces should be equal to or larger than 0.153mm(6mil). |
15 |
Finished Hole Size |
0.3--6.5mm |
For the plated hole wall, the finished hole size is smaller than the one in file. |
16 |
Hole Size Tolerance |
±0.075mm |
eg. For the 0.6mm hole, the finished hole size between 0.525mm to 0.675mm is acceptable. |
17 |
Solder Mask |
LPI |
Liquid Photo-Imageable Solder Mask |
18 |
Min. Character Width |
≥0.15mm |
Characters width less than 0.15mm will be unidentifiable. |
19 |
Min. Character Height |
≥0.8mm |
Characters height less than 0.8mm will be unidentifiable. |
20 |
Character Width to Height Ratio |
1:5 |
1:5 is the best ratio for producation. |
21 |
Trace to Outline |
≥0.3mm(12mil) |
Rounting: Trace to Outline≥0.3mm; V-scoring: Trace to Outline |
22 |
Panelization without space |
0 |
For V-scoring panelization, set the space between boards to be 0. |
23 |
Panelization with space |
1.6mm |
For Rounting panelization,set the space between boards to be ≥1.6mm. |
24 |
Polygon Pour with Pads |
Hatch |
Please attention that we will apply Hatch to do Polygon Pour if your PCBs designed with Pads. |
25 |
Slot Drawing with Pads |
Drill Drawing Layer |
With many unplated grooves, please draw them in Drill Drawing Layer. |
26 |
Protel/dxp Override Layer |
Solder Layer |
Do not mistake the Paste Layer as Solder Layer. |
27 |
Protel/dxp Keepout Layer |
Keepout Layer/Mechanical Layer |
Choose one from Keepout Layer or Mechanical Layer as outline. |
28 |
Min. Half Hole Diameter |
0.6mm |
Half hole is a special technology, so half hole diameter should be greater than 0.6mm. |
29 |
Soldermask Bridge |
0.1mm |
Solderbridge is available but it will charge extra fee. |